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| TI Ref No : | 532249695 |
|---|---|
| Description : | Bof Items Bracket, Cover, Housing, Cpu Module, Audio Module, Mother Board Module, Bonding Strip, Front Plate Of Cu, H Cu Housing, Cu If Module##quantity: 500## |
| Date : | 2026-05-01 |
| Deadline : | 2026-05-11 |
| Document Type : | Tenders |
