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| TI Ref No : | 532029980 |
|---|---|
| Description : | Nantong Kangyuan Integrated Circuit Packaging Substrate Project (phase I)- Vertical Continuous Panel Plating Line 1set |
| Date : | 2026-04-24 |
| Deadline : | 2026-05-15 |
| Document Type : | Tenders |
| TI Ref No : | 532029980 |
|---|---|
| Description : | Nantong Kangyuan Integrated Circuit Packaging Substrate Project (phase I)- Vertical Continuous Panel Plating Line 1set |
| Date : | 2026-04-24 |
| Deadline : | 2026-05-15 |
| Document Type : | Tenders |