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| TI Ref No : | 532002860 |
|---|---|
| Description : | Request For Proposal For Mmic Assembly, Packaging And Screening In Kyocera Packages Packaged Spdt Mmic Die, Mmic Die Spdt Lat, Mmic Die Spdt Wlat, Packaged Digital Attenuator (da) Mmic Die (type-1), Mmic Die Digital Attenuator (da) (type-1) Lat, Packaged |
| Date : | 2026-04-24 |
| Deadline : | 2026-05-21 |
| Document Type : | Tenders |
