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| TI Ref No : | 531085924 |
|---|---|
| Description : | Development Project For The Batch Molding Preparation Of Tmmc Conductor Skeleton And Coil Testing Tooling At The Hefei Institute Of Physical Science, Chinese Academy Of Sciences. |
| Date : | 2026-04-01 |
| Deadline : | 2026-04-22 |
| Document Type : | Tenders |
