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| TI Ref No : | 530731251 |
|---|---|
| Description : | Nantong Kangyuan Integrated Circuit Packaging Substrate Project (phase I)- Automated Warehouse 1 Set |
| Date : | 2026-03-23 |
| Deadline : | 2026-04-14 |
| Document Type : | Tenders |
| TI Ref No : | 530731251 |
|---|---|
| Description : | Nantong Kangyuan Integrated Circuit Packaging Substrate Project (phase I)- Automated Warehouse 1 Set |
| Date : | 2026-03-23 |
| Deadline : | 2026-04-14 |
| Document Type : | Tenders |