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| TI Ref No : | 531150216 |
|---|---|
| Description : | Contract Awarded For Procure One Set Of Brand-new 8-inch Taiko Wafer Thinning Machine For The 8-inch Line Backside Taiko Thinning Process. This Is To Achieve The Backside Taiko Thinning Process In The Wafer Fabrication Flow Of Semiconductor Integrated Ci |
| Date : | 2026-04-02 |
| Deadline : | 2026-06-30 |
| Document Type : | Contracts |
