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| TI Ref No : | 530638347 |
|---|---|
| Description : | Supply Of Moving Spring Assembly For Qbca1 Relay, Designed According To Specific Drawings, Without Silver Contact. The Assembly Is Intended For Use In Relay Applications. Moving Spring Assembly For Qbca1 Relay |
| Date : | 2026-03-20 |
| Deadline : | 2026-07-15 |
| Document Type : | Contracts |
